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1

Characteristics and fabrication of NiTi/Si diaphragm micropump

Dong Xu, Li Wang, Guifu Ding, Yong Zhou, Aibing Yu, Bingchu Cai

Journal:

Sensors and Actuators A: Physical

Année:

2001

Langue:

english

Fichier:

PDF, 204 KB

english, 2001

2

Simulation and characterization of a thin film Au/Ni micro hot bridge-wire ignition element under capacitor discharging

Xu, Qiu, Yang, Zhuoqing, Zhang, Qihuan, Sun, Yunna, Wang, Yang, Wang, Hong, Ding, Guifu, Zhao, Xiaolin

Journal:

International Journal of Thermal Sciences

Année:

2016

Langue:

english

Fichier:

PDF, 3.88 MB

english, 2016

3

A contact-enhanced MEMS inertial switch with electrostatic force assistance and multi-step pulling action for prolonging contact time

Li, Jian, Wang, Yan, Li, Yue, Fu, Bo, Sun, Yunna, Yao, Jinyuan, Ding, Guifu, Zhao, Xiaolin, Yang, Zhuoqing

Journal:

Microsystem Technologies

Année:

2018

Langue:

english

Fichier:

PDF, 3.04 MB

english, 2018

4

Dynamic simulation of a contact-enhanced MEMS inertial switch in Simulink®

Zhuoqing Yang, Haogang Cai, Guifu Ding, Hong Wang, Xiaolin Zhao

Journal:

Microsystem Technologies

Année:

2011

Langue:

english

Fichier:

PDF, 1.55 MB

english, 2011

5

Modeling, Simulation and Characterization of a Micromachined Acceleration Switch With Anti-Stiction Raised Strips on the Substrate

Zhuoqing Yang, Guifu Ding, Hong Wang, Haogang Cai, Xiaolin Zhao

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2011

Langue:

english

Fichier:

PDF, 1.24 MB

english, 2011

6

Design, simulation and fabrication of a novel contact-enhanced MEMS inertial switch with a movable contact point

Cai, Haogang, Ding, Guifu, Yang, Zhuoqing, Su, Zhijuan, Zhou, Jiansheng, Wang, Hong

Journal:

Journal of Micromechanics and Microengineering

Année:

2008

Langue:

english

Fichier:

PDF, 2.49 MB

english, 2008

7

[IEEE 2010 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS 2010) - Xiamen (2010.01.20-2010.01.23)] 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems - A new electroplating mask for deep wet etching on glass

Xiaodan Miao,, Xuhan Dai,, Peihong Wang,, Xiaopeng Zhang,, Xiaolin Zhao,, Guifu Ding,

Année:

2010

Langue:

english

Fichier:

PDF, 196 KB

english, 2010

8

Experimental and numerical investigation of a microchannel heat sink (MCHS) with micro-scale ribs and grooves for chip cooling

Wang, Guilian, Niu, Di, Xie, Fuqiang, Wang, Yan, Zhao, Xiaolin, Ding, Guifu

Journal:

Applied Thermal Engineering

Année:

2015

Langue:

english

Fichier:

PDF, 3.43 MB

english, 2015

9

Shock-Resistibility of MEMS-Based Inertial Microswitch under Reverse Directional Ultra-High g Acceleration for IoT Applications

Xu, Qiu, Yang, Zhuoqing, Sun, Yunna, Lai, Liyan, Jin, Zhiyu, Ding, Guifu, Zhao, Xiaolin, Yao, Jinyuan, Wang, Jing

Journal:

Scientific Reports

Année:

2017

Langue:

english

Fichier:

PDF, 2.76 MB

english, 2017

10

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Development of a Polyimide/SiC-Whisker/Nano-Particles Composite with High Thermal Conductivity and Low Coefficient of Thermal Expansion as Dielectric Layer for Interposer Application

Sun, Yunna, Luo, Jiangbo, Yang, Zhuoqing, Wang, Yan, Ding, Guifu, Wang, Zhenqian

Année:

2018

Langue:

english

Fichier:

PDF, 660 KB

english, 2018

11

Nanoporous Copper Films with High Surface Area Formed by Chemical Dealloying from Electroplated CuZn Alloy

Zhang, Congchun, Yue, Heng, Wang, Hong, Ding, Guifu, Xiaolin, Zhao

Journal:

Micro and Nanosystems

Année:

2016

Fichier:

PDF, 4.05 MB

2016

12

Effect of nitrogen doping temperature on the resistance stability of ITO thin films

Yang, Shenyong, Zhang, Congchun, Yang, Zhuoqing, Yao, Jinyuan, Wang, Hong, Ding, Guifu

Journal:

Journal of Alloys and Compounds

Année:

2018

Langue:

english

Fichier:

PDF, 29.27 MB

english, 2018

13

A High Sensitive Flexible Pressure Sensor Designed by Silver Nanowires Embedded in Polyimide (AgNW-PI)

Li, Hongfang, Ding, Guifu, Yang, Zhuoqing

Journal:

Année:

2019

Langue:

english

Fichier:

PDF, 7.37 MB

english, 2019

14

Manipulating fluid with vibrating 3D-printed paddles for applications in micropump

Tang, Zhiyong, Shao, Xiufeng, Huang, Jianze, Yao, Jinyuan, Ding, Guifu

Journal:

Nanotechnology and Precision Engineering

Année:

2019

Langue:

english

Fichier:

PDF, 3.55 MB

english, 2019

15

Design and implementation of a bistable microcantilever actuator for magnetostatic latching relay

Yibo Wu, Guifu Ding, Congchun Zhang, Juang Wang, Shengping Mao, Hong Wang

Journal:

Microelectronics Journal

Année:

2010

Langue:

english

Fichier:

PDF, 1.12 MB

english, 2010

16

Design, fabrication and characterization of a bistable electromagnetic microrelay with large displacement

Xiaodan Miao, Xuhan Dai, Peihong Wang, Guifu Ding, Xiaolin Zhao

Journal:

Microelectronics Journal

Année:

2011

Langue:

english

Fichier:

PDF, 1.47 MB

english, 2011

17

Design and simulation of a novel bridge-like coplanar waveguide for microelectromechanical systems

Xiaofeng Sun, Guifu Ding, Hong Wang, Zhenxin Jiang, Binhong Li, Minyi Shen

Journal:

Microsystem Technologies

Année:

2008

Langue:

english

Fichier:

PDF, 277 KB

english, 2008

18

Micromechanical characterization of electroplated permalloy films for MEMS

Xueping Li, Guifu Ding, Taeko Ando, Mitsuhiro Shikida, Kazuo Sato

Journal:

Microsystem Technologies

Année:

2008

Langue:

english

Fichier:

PDF, 258 KB

english, 2008

19

A directly strain measuring method for electroplated nickel micro-tensile test

Jun Tang, Hong Wang, Rui Liu, Xueping Li, Zhenjie Zhang, Jinyuan Yao, Guifu Ding

Journal:

Microsystem Technologies

Année:

2010

Langue:

english

Fichier:

PDF, 588 KB

english, 2010

20

Preparing of a high speed bistable electromagnetic RF MEMS switch

Yong-hua Zhang, Guifu Ding, Xiaofeng Shun, Donghua Gu, Bingchu Cai, Zongsheng Lai

Journal:

Sensors and Actuators A: Physical

Année:

2007

Langue:

english

Fichier:

PDF, 1.38 MB

english, 2007

21

Study of a novel cathode tool structure for improving heat removal in electrochemical micro-machining

Jing Wu, Hong Wang, Xiang Chen, Ping Cheng, Guifu Ding, Xiaolin Zhao, Yi Huang

Journal:

Electrochimica Acta

Année:

2012

Langue:

english

Fichier:

PDF, 1.38 MB

english, 2012

22

Electroplated hard magnetic material and its application in microelectromechanical systems

Yufeng Su, Hong Wang, Guifu Ding, Feng Cui, Weiping Zhang, Wenyuan Chen

Journal:

IEEE Transactions on Magnetics

Année:

2005

Langue:

english

Fichier:

PDF, 1.12 MB

english, 2005

23

Low-stress permalloy for magnetic MEMS switches

Yonghua Zhang, Guifu Ding, Hong Wang, Shi Fu, Bingchu Cai

Journal:

IEEE Transactions on Magnetics

Année:

2006

Langue:

english

Fichier:

PDF, 655 KB

english, 2006

24

Design, Simulation, and Characterization of a Low-Cost In-Plane Spark Gap Microswitch With Dual-Trigger Electrode for Pulsed Power Applications

Liu, Chang, Yang, Zhuoqing, Ding, Guifu, Zhou, Zhenwei, Liu, Qifa, Huang, Yi, Zheng, Yu

Journal:

IEEE Transactions on Industrial Electronics

Année:

2013

Langue:

english

Fichier:

PDF, 928 KB

english, 2013

25

A micro-tensile method for measuring mechanical properties of MEMS materials

Liu, Rui, Wang, Hong, Li, Xueping, Ding, Guifu, Yang, Chunsheng

Journal:

Journal of Micromechanics and Microengineering

Année:

2008

Langue:

english

Fichier:

PDF, 1.18 MB

english, 2008

26

[IEEE 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS) - Taipei, Taiwan (2013.01.20-2013.01.24)] 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS) - An inertial micro-switch with compliant cantilever fixed electrode for prolonging contact time

Wang, Yan, Chen, Wenguo, Yang, Zhuoqing, Ding, Guifu, Wang, Hong, Zhao, Xiaolin

Année:

2013

Langue:

english

Fichier:

PDF, 2.07 MB

english, 2013

27

Fabrication of a novel contact-enhanced horizontal sensitive inertial micro-switch with electroplating nickel

Chen, Wenguo, Wang, Yongliang, Zhang, Yonghua, Cheng, Ping, Wang, Yan, Ding, Guifu, Zhao, Xiaolin, Yang, Zhuoqing

Journal:

Microelectronic Engineering

Année:

2014

Langue:

english

Fichier:

PDF, 2.61 MB

english, 2014

28

Tactile probing system based on micro-fabricated capacitive sensor

He, Mingxuan, Liu, Rui, Li, Yuan, Wang, Hong, Lu, Xin, Ding, Guifu, Wu, Junjie, Zhang, Ting, Zhao, Xiaolin

Journal:

Sensors and Actuators A: Physical

Année:

2013

Langue:

english

Fichier:

PDF, 1.47 MB

english, 2013

29

Effect of thermal treatment on the mechanical properties of Cu specimen fabricated using electrodeposition bath for through-silicon-via filling

Wang, Huiying, Cheng, Ping, Wang, Su, Wang, Hong, Gu, Ting, Li, Junyi, Gu, Xiao, Ding, Guifu

Journal:

Microelectronic Engineering

Année:

2014

Langue:

english

Fichier:

PDF, 1.63 MB

english, 2014

30

Influence of applied acceleration loads on contact time and threshold in an inertial microswitch with flexible contact-enhanced structure

Chen, Wenguo, Yang, Zhuoqing, Wang, Yan, Ding, Guifu, Wang, Hong, Zhao, Xiaolin

Journal:

Sensors and Actuators A: Physical

Année:

2014

Langue:

english

Fichier:

PDF, 5.01 MB

english, 2014

31

[IEEE 2010 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS 2010) - Xiamen (2010.01.20-2010.01.23)] 2010 IEEE 5th International Conference on Nano/Micro Engineered and Molecular Systems - Design and simulation of MEMS-based CPW-fed unidirectional antenna array with air bridges

Zhijuan Su,, Guifu Ding,, Wenjing Lu,, Jifeng Chen,

Année:

2010

Langue:

english

Fichier:

PDF, 210 KB

english, 2010

32

Simultaneous filling of through silicon vias (TSVs) with different aspect ratios using multi-step direct current density

Wang, Zhaoyu, Wang, Hong, Cheng, Ping, Ding, Guifu, Zhao, Xiaolin

Journal:

Journal of Micromechanics and Microengineering

Année:

2014

Langue:

english

Fichier:

PDF, 1.32 MB

english, 2014

33

[IEEE 2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2013.11.11-2013.11.13)] 2013 3rd IEEE CPMT Symposium Japan - Growth models of copper filling in through silicon via at different current density

Wang, Zhaoyu, Cheng, Ping, Wang, Hong, Guo, Honglei, Ding, Guifu, Zhao, Xiaolin, Li, Jianhua

Année:

2013

Langue:

english

Fichier:

PDF, 823 KB

english, 2013

34

Segmented magnetic circuit simulation of the large displacement planar micro-coil actuator with enclosed magnetic yokes

Miao, Xiaodan, Dai, Xuhan, Huang, Yi, Ding, Guifu, Zhao, Xiaolin

Journal:

Microelectronic Engineering

Année:

2014

Langue:

english

Fichier:

PDF, 2.98 MB

english, 2014

35

Simulation, fabrication and characterization of an all-metal contact-enhanced triaxial inertial microswitch with low axial disturbance

Chen, Wenguo, Wang, Yan, Ding, Guifu, Wang, Hong, Zhao, Xiaolin, Yang, Zhuoqing

Journal:

Sensors and Actuators A: Physical

Année:

2014

Langue:

english

Fichier:

PDF, 1.92 MB

english, 2014

36

[IEEE 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems - Sanya, China (2008.01.6-2008.01.9)] 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems - Design and contact dynamics simulation of an inertia micro-switch based on non-silicon substrate

Zhuoqing Yang,, Guifu Ding,, Haogang Cai,, Rui Liu,, Xiaolin Zhao,

Année:

2008

Langue:

english

Fichier:

PDF, 874 KB

english, 2008

37

Novel electro-thermal latching micro-switch based on Ni/electrophoretic polymer micro-cantilevers

Cheng, Ping, Zhang, Ying, Mao, Shenping, Wang, Hong, Ding, Guifu, Zhang, Congchun, Dai, Xuhan, Zhao, Xiaolin

Journal:

Journal of Micromechanics and Microengineering

Année:

2014

Langue:

english

Fichier:

PDF, 1.77 MB

english, 2014

38

Simulation and characterization of a laterally-driven inertial micro-switch

Chen, Wenguo, Wang, Yang, Wang, Huiying, Wang, Yan, Ding, Guifu, Yang, Zhuoqing, Wang, Hong, Zhao, Xiaolin

Journal:

Année:

2015

Langue:

english

Fichier:

PDF, 2.37 MB

english, 2015

39

Optimization of innovative approaches to the shortening of filling times in 3D integrated through-silicon vias (TSVs)

Zhang, Yazhou, Ding, Guifu, Wang, Hong, Cheng, Ping, Liu, Rui

Journal:

Journal of Micromechanics and Microengineering

Année:

2015

Langue:

english

Fichier:

PDF, 271 KB

english, 2015

40

Design, fabrication and measurement of a novel 140 GHz folded waveguide based on SU-8 UV-LIGA technology

Xie, Fuqiang, Ding, Guifu, Zhao, Xiaolin, Cheng, Ping

Journal:

Journal of Micromechanics and Microengineering

Année:

2015

Langue:

english

Fichier:

PDF, 2.69 MB

english, 2015

41

Simulation and characterization of dynamic contact in a MEMS passive vibration threshold sensor

Yang, Zhuoqing, Chen, Wenguo, Ding, Guifu, Wang, Yan, Wang, Hong, Zhao, Xiaolin

Journal:

Microsystem Technologies

Année:

2016

Langue:

english

Fichier:

PDF, 4.23 MB

english, 2016

42

[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Thermal effects of TSV (through silicon via) with void

Sun, Yunna, Kim, Hui-Yeol, Wang, Yan, Ding, Guifu, Zhao, Junhong, Wang, Hong

Année:

2014

Langue:

english

Fichier:

PDF, 1.47 MB

english, 2014

43

Fabrication and characterization of a low-g inertial microswitch with flexible contact point and limit-block constraints

Chen, Wenguo, Yang, Zhuoqing, Wang, Yan, Ding, Guifu, Wang, Hong, Zhao, Xiaolin

Journal:

IEEE/ASME Transactions on Mechatronics

Année:

2015

Langue:

english

Fichier:

PDF, 2.54 MB

english, 2015

44

Effect of current density on microstructure and mechanical property of Cu micro-cylinders electrodeposited in through silicon vias

Wang, Huiying, Cheng, Ping, Wang, Hong, Liu, Rui, Sun, Liming, Rao, Qunli, Wang, Zhaoyu, Gu, Ting, Ding, Guifu

Journal:

Materials Characterization

Année:

2015

Langue:

english

Fichier:

PDF, 1.46 MB

english, 2015

45

Design and fabrication of a laterally-driven inertial micro-switch with multi-directional constraint structures for lowering off-axis sensitivity

Zhang, Qihuan, Yang, Zhuoqing, Xu, Qiu, Wang, Yang, Ding, Guifu, Zhao, Xiaolin

Journal:

Journal of Micromechanics and Microengineering

Année:

2016

Langue:

english

Fichier:

PDF, 3.50 MB

english, 2016

46

Microstructure of Electrodeposited Cu Micro-cylinders in High-Aspect-Ratio Blind Holes and Crystallographic Texture of the Cu Overburden Film

Zhang, Yazhou, Ding, Guifu, Wang, Hong, Cheng, Ping

Journal:

Journal of Materials Science & Technology

Année:

2016

Langue:

english

Fichier:

PDF, 3.86 MB

english, 2016

47

High temperature sensors fabricated on Al2O3 ceramic and nickel-based superalloy substrates

Wang, Yanlei, Zhang, Congchun, Niu, Di, Ding, Guifu, Duan, Li

Journal:

Sensors and Actuators A: Physical

Année:

2016

Langue:

english

Fichier:

PDF, 2.95 MB

english, 2016

48

A minimally invasive micro sampler for quantitative sampling with an ultrahigh-aspect-ratio microneedle and a PDMS actuator

Liu, Long, Wang, Yan, Yao, Jinyuan, Yang, Cuijun, Ding, Guifu

Journal:

Biomedical Microdevices

Année:

2016

Langue:

english

Fichier:

PDF, 2.46 MB

english, 2016

49

Electrical insulation of ceramic thin film on metallic aero-engine blade for high temperature sensor applications

Gao, Junchao, Duan, Franklin Li, Yu, Chang, Meng, Wentao, Liu, Lizuo, Ding, Guifu, Zhang, Congchun, Wang, Ying

Journal:

Ceramics International

Année:

2016

Langue:

english

Fichier:

PDF, 1.21 MB

english, 2016

50

A surface-micromachining-based inertial micro-switch with compliant cantilever beam as movable electrode for enduring high shock and prolonging contact time

Xu, Qiu, Yang, Zhuoqing, Fu, Bo, Li, Jianhua, Wu, Hao, Zhang, Qihuan, Sun, Yunna, Ding, Guifu, Zhao, Xiaolin

Journal:

Applied Surface Science

Année:

2016

Langue:

english

Fichier:

PDF, 4.84 MB

english, 2016